岗位职责
工作描述:-Packagesolutionconsultingandevaluation.-Definepackagenetlistbasedonchip-packageco-designmethodology.-IOplanningtogetherwithphysicaldesigner.-PackageERCchecking,packagedesignrulechecking,PODdocumentcreating.-Supportonsystem-moduleSI/PIco-simulation&PCBdesignwork.-Packagedesignsign-off.-Developpackagedesignmethodology,preferadvanced2.5D/3Dpackagedesignsolution任职要求: 1.EE/MErelatedbackgroundinsystem/chipdesign.2.Solidknowledgeandextensiveindustryexperienceinoneormoreofthefollowingareas:-Highspeedpackage/systemdesignexperience(HighSpeedSerdes,HighCurrent,HBM,DDR,etc...)-FamiliarwithIndustrySI/PIanalysisprocess,systemlevelmodelingandfiniteelementanalysis tools(AnsysHSFF,Sigrity,SigXp,Spice,etc...)-MultiplelayersPCB/Laminatelayoutexperience(Experiencewithautomationsoftware,suchascadenceAPDandrelateddesigntools,andskilllanguageprogrammingisaplus)3.GoodgraspofPerl/TCLscriptsunderLinux/Unixenvironment.Cprogrammingwillbeaplus.4.GoodcommunicationskillinbothEnglishandMandarin.5.UnderstandingofASICphysicaldesignprocess/tools,advancedsemiconductortechnologyprocessanddevicephysicsisaplus6.Strongteamworksense,goodlearningcompetency,self-motivated,andabilitytoworkindiverseareasinaflexibleanddynamicenvironment.行业要求：电子/半导体/集成电路
工作地址
渝北区-渝北区 （重庆-渝北区象帝先计算技术（重庆）有限公司） 查看地图
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