Package Technology Development Manager

岗位职责

Summary:1.Newpackagetechnologydevelopment2.Path-findingfornewpackagerelatedprocessflow3.Leadnewpackagematerialstudyandqualification.RESPONSIBILITIES:1.Leadateamtodevelopnewpackagetechnologyandrelatedprocessflow.2.Surveynewmaterialtomakepackagemorereliable,morerobustandcompetitive.3.Workwithassemblyhouseandmaterialvendortodevelopandqualifythenewmaterialsandnewpackage.4.Coordinatesthequalificationofnewmaterials,package,assemblyprocesses,anddrivetheevaluationforsuppliercurrentprocessandmaterialchange.5.Qualifynewsupplieranddevelopcurrentsuppliercapabilityandmanagesupplierrelationship.6.SumuptheexperienceofPackageprocess,SMTprocessandmaintain/updatetheassemblybaseline.7.Performothertasksassignedbysupervisor.REQUIREMENTS:1.Intensivehands-onexperienceonpackagetechnologyandprocessdevelopment.2.Beproficientindifferentprocessesofpackage,suchaswafergrinding,wafersaw,dieattach,flipchipdieattach,plasmaclean,wirebond,moldingprocess,laserablation,lasermarkingprocess,andetc.3.Bachelor/master’sdegreewith10+yearsdirectlyrelatedexperience,orDoctordegreewith5+relatedexperience.4.Sufficientknowledgeaboutsemiconductorsupplychain,befamiliarwithassemblysub-con,packageBOMvendor.5.FluentoralandwrittenEnglishisrequired.6.Havemachinemaintenanceknowledgeisaplus.7.Workproactively.职能类别：封装工程师关键字：TDsmtmaterialspackage