Physical design/IC design/后端设计/物理设计

岗位职责

JD：ASIC或SoC芯片的模块级和顶层级物理设计；模块或芯片系统级电源地网络设计和验证；低功耗物理设计和验证；前后端时序优化，芯片级时序验证；模块和顶层版图物理验证，DRC/LVS/ERC等；完成netlist到GDSII的全流程工作：floorplan，powerplanning，place&route，cts,timingclosure，poweranalysis，physicalverification，ECO；Requirements：大学本科以上学历，微电子／电子工程／通信工程等相关专业；相关的IC后端设计工作经验或tape-out成功经验；熟悉PNR，STA，DRC，LVS、DRC等流程；熟悉EDA工具，如ICC2，Innovus,Primetime,Calibre,redhawk等；熟练使用tcl/perl/phython等；良好的英文沟通能力；公司简介：Foundedin2018,founderhas20years’ICindustryexperience,workedfortopICcompanieslikeIBM,AMD,Synopsys,Verisilicon,SYNAPSEandIntelasleader,haslong-term,solidandpositiverelationshipswithallpatterners.Andtheteammembersmosthave10+years’ICdesignexperience,mergingwiththefastestgrowingtechnologybothinASICandSOCfield,patternerincludingAMD,ADI，GlobalFoundries,HiGon,ZTE，GPT,SYNAPSE，MICROPILOT…Massproductionincludingdiverseproductions:7nm/14nmGPUdesignchip,28nmhigh-endgraphicchip,28nmmobilephonechip,28nmlow-powergraphicchip,40nmnetworkingchipset,55nmmobilechip…wealsoprovideprofessional,effectiveandpracticalconsultingservicefornewlyestablishedcompany.NowwehaveBeijing,Shanghai,Nanjing,Chengdusites,tosupportflexibleandhigh-efficiencyworkingmodelbothforpatternerandemployee.职能类别：数字后端工程师关键字：ICBackendphysicaldesign后端设计物理设计PNR