Digital Failure Analysis Engineer

岗位职责

岗位职责JobResponsibilities：·主要负责芯片数字部分的失效分析工作。包括电学失效定位与物理层面失效机理定位。·Beresponsibleforthefailureanalysisofdigitalrelatedfailure,includingbutnotlimitedtoelectricalfailureanalysis(EFA)andphysicalfailureanalysis(PFA).·制定数字芯片失效分析方案，运用各种FA工具和技术对失效样品进行分析。·Developdigitalrelatedfunctionfailureanalysisplans,usevariousadvancedanalysistoolsandtechniquestoanalyzefailedsamples.·与设计，工艺，测试部门紧密合作。协同解决芯片在研发、生产和应用过程中的失效问题，找到根本原因。·Workcloselywithdesign,technologydevelopmentandtestdepartmentcollaborativelytosolvethefailureproblemsthatoccurduringtheR&D,production,andapplication.Digouttherootcause.·撰写失效分析报告，清晰阐述失效原因、分析过程和结论，为产品质量提升和研发改进提供有力支持。·Writedetailedfailureanalysisreports,clearlystatingthefailurecause,analysisprocess,andconclusion,providingstrongsupportforproductqualityimprovementandR&Dimprovement.任职要求/JobRequirement·电子工程、微电子等相关专业硕士及以上学历，具有3年以上数字芯片失效分析工作经验。·Master'sdegreeorabovewithrelatedmajorofelectronicengineering,microelectronics.Withatleast3yearsofworkingexperienceindigitalICfailureanalysis.·对于常见的数字IC失效，比如scanchain,SRAM,FLASHandMCU等产品具有相关的失效分析工作经验。·Experiencewithcommondigitalfunctionrelatedfailureanalysiscase,suchasscanchain,SRAM,FLASHandMCUfailurecaseandregisterread/writefailurecase.·熟悉常用的分析工具，比如LADA、SDL、EOP/EOM(或者LTP)、Nanoprobe、EBIC、EOBIRCH、SEM和FIB等工具。·FamiliarwithcommonlyusedanalysistoolssuchasLADA,SDL,EOP/EOM(orLTP),Nanoprobe,EBIC,EOBRICH,SEMandFIB.·假如熟悉一些嵌入式系统（CPLD/树莓派）硬件编程语言